目次
1.要旨
2.調査方法
2.1.二次調査
2.2.一次データ収集
2.3.市場形成と検証
2.4.報告書作成、品質チェック、納品
3.市場構造
3.1.市場への配慮
3.2.前提条件
3.3.限界
3.4.略語
3.5.情報源
3.6.定義
4.経済・人口統計
5.フリップチップの世界市場展望
5.1.市場規模(金額ベース
5.2.地域別市場シェア
5.3.バンピング技術別の市場規模および予測
5.4.市場規模・予測:包装技術別
5.5.市場規模および予測:産業分野別
6.アジア太平洋地域のフリップチップ市場展望
6.1.市場規模:金額別
6.2.国別市場シェア
6.3.バンピング技術別の市場規模および予測
6.4.市場規模・予測:包装技術別
6.5.市場規模・予測:産業分野別
7.市場ダイナミクス
7.1.市場促進要因と機会
7.2.市場の阻害要因と課題
7.3.市場動向
7.3.1.XXXX
7.3.2.XXXX
7.3.3.XXXX
7.3.4.XXXX
7.3.5.XXXX
7.4.コビッド19効果
7.5.サプライチェーン分析
7.6.政策と規制の枠組み
7.7.業界専門家の見解
7.8.中国フリップチップ市場の展望
7.8.1.市場規模(金額ベース
7.8.2.バンプ技術別の市場規模と予測
7.8.3.包装技術別の市場規模・予測
7.8.4.産業別市場規模・予測
7.9.日本のフリップチップ市場展望
7.9.1.金額別市場規模
7.9.2.バンプ技術別の市場規模および予測
7.9.3.包装技術別の市場規模・予測
7.9.4.産業別市場規模・予測
7.10.インドのフリップチップ市場展望
7.10.1.金額別市場規模
7.10.2.バンプ技術別の市場規模と予測
7.10.3.包装技術別の市場規模・予測
7.10.4.産業別市場規模・予測
7.11.オーストラリアのフリップチップ市場展望
7.11.1.金額別市場規模
7.11.2.バンプ技術別の市場規模と予測
7.11.3.包装技術別の市場規模・予測
7.11.4.産業別市場規模・予測
7.12.韓国のフリップチップ市場展望
7.12.1.金額別市場規模
7.12.2.バンプ技術別の市場規模と予測
7.12.3.包装技術別の市場規模・予測
7.12.4.産業別市場規模・予測
8.競争環境
8.1.競合ダッシュボード
8.2.主要企業の事業戦略
8.3.主要企業の市場ポジショニングマトリックス
8.4.ポーターの5つの力
8.5.会社概要
8.5.1.アムコー・テクノロジー
8.5.1.1.会社概要
8.5.1.2.会社概要
8.5.1.3.財務ハイライト
8.5.1.4.地理的洞察
8.5.1.5.事業セグメントと業績
8.5.1.6.製品ポートフォリオ
8.5.1.7.主要役員
8.5.1.8.戦略的な動きと展開
8.5.2.台湾積体電路製造股份有限公司
8.5.3.インテル コーポレーション
8.5.4.テキサス・インスツルメンツ・インコーポレイテッド
8.5.5.アドバンスト・マイクロ・デバイス
8.5.6.アドバンスト・セミコンダクター・エンジニアリング社
8.5.7.STMicroelectronics NV
8.5.8.パワーテック・テクノロジー
8.5.9.ブロードコム
8.5.10.インフィニオンテクノロジーズAG
8.5.11.江蘇長江電子科技有限公司
8.5.12.ファラデーテクノロジー
9.戦略的提言
10.付録
10.1.よくある質問
10.2.注意事項
10.3.関連レポート
11.免責事項
図表一覧
図1:フリップチップの世界市場規模(億ドル)、地域別、2023年・2029年
図2: 市場魅力度指数(2029年地域別)
図3: 市場魅力度指数(2029年):セグメント別
図4: フリップチップの世界市場規模(金額ベース)(2018年、2023年、2029F)(単位:億米ドル)
図5:フリップチップの世界地域別市場シェア(2023年)
図6:アジア太平洋地域のフリップチップ市場規模:金額(2018年、2023年、2029年)(単位:億米ドル)
図7:アジア太平洋地域のフリップチップの国別市場シェア(2023年)
図8:中国のフリップチップ市場規模:金額(2018年、2023年、2029年)(単位:億米ドル)
図9:日本のフリップチップ市場規模:金額(2018年、2023年、2029年)(単位:億米ドル)
図10:インドのフリップチップ市場規模:金額(2018年、2023年、2029年)(単位:億米ドル)
図11: オーストラリアのフリップチップ市場規模:金額(2018年、2023年、2029年)(単位:億米ドル)
図12: 韓国のフリップチップ市場規模:金額(2018年、2023年、2029年) (単位:億米ドル)
図13: 上位5社の競争ダッシュボード(2023年)
図14: フリップチップ世界市場のポーターの5つの力
表一覧
表1:フリップチップの世界市場スナップショット(セグメント別)(2023年・2029年)(単位:億米ドル
表2:上位10カ国の経済スナップショット(2022年
表3:その他の主要国の経済スナップショット(2022年
表4: 外貨から米ドルへの平均為替レート
表5:フリップチップの世界市場規模および予測:バンプ技術別(2018~2029F)(単位:億米ドル)
表6:フリップチップの世界市場規模・予測:パッケージ技術別(2018~2029F)(単位:億米ドル)
表7:フリップチップの世界市場規模・予測:産業分野別(2018~2029F)(単位:億米ドル)
表8:アジア太平洋地域のフリップチップ市場規模・予測:バンプ技術別(2018年~2029F)(単位:億米ドル)
表9:アジア太平洋地域のフリップチップ市場規模・予測:パッケージング技術別(2018~2029F)(単位:億米ドル)
表10:アジア太平洋地域のフリップチップ市場規模・予測:産業分野別(2018年~2029年)(単位:億米ドル)
表11:フリップチップ市場の影響要因(2023年
表12:中国フリップチップ市場規模・予測:バンプ技術別(2018年~2029年)(単位:億米ドル)
表13:中国フリップチップ市場規模・予測:パッケージング技術別(2018〜2029F)(単位:億米ドル)
表14:中国フリップチップ市場規模・予測:産業分野別(2018年~2029F)(単位:億米ドル)
表15:日本のフリップチップ市場規模・予測:バンプ技術別(2018年~2029F)(単位:億米ドル)
表16:日本のフリップチップ市場規模・予測:パッケージング技術別(2018年~2029F)(単位:億米ドル)
表17:日本のフリップチップ市場規模・予測:産業分野別(2018年~2029F)(単位:億米ドル)
表18:インドのフリップチップ市場規模・予測:バンプ技術別(2018年~2029F)(単位:億米ドル)
表19:インドのフリップチップ市場規模・予測:パッケージング技術別(2018年~2029F)(単位:億米ドル)
表20:インドのフリップチップ市場規模・予測:産業分野別(2018年~2029F)(単位:億米ドル)
表21:オーストラリア フリップチップ市場規模・予測:バンプ技術別(2018年~2029F) (単位:億米ドル)
表22: オーストラリアのフリップチップ市場規模・予測:パッケージング技術別 (2018〜2029F) (単位:億米ドル)
表23: オーストラリアのフリップチップ市場規模・予測:産業分野別(2018年~2029F) (単位:億米ドル)
表24: 韓国のフリップチップ市場規模・予測:バンプ技術別 (2018〜2029F) (単位:億米ドル)
表25:韓国のフリップチップ市場規模・予測:パッケージング技術別 (2018〜2029F) (単位:億米ドル)
表26:韓国のフリップチップ市場規模・予測:産業分野別(2018~2029F) (単位:億米ドル)
According to the research report, “Asia Pacific Flip Chip Market Outlook, 2029,” published by Bonafide Research, the Asia Pacific Flip Chip market is anticipated to grow with more than 4% CAGR from 2024–2029. Countries like China, South Korea, and Taiwan have implemented stringent quality and safety standards for electronic components, including flip chips. Compliance with these regulations is crucial for market entry and product approval. Additionally, export controls and trade restrictions can impact the supply chain and pricing dynamics. Opportunities for growth in the APAC flip chip market abound, driven by the region's expanding electronics manufacturing base. Government initiatives to promote semiconductor and electronics industries, coupled with increasing research and development investments, create a favorable environment for flip chip technology. Trade shows and conferences focused on semiconductor packaging and assembly provide platforms for industry players to showcase their capabilities and network with potential customers. Pricing in the APAC flip chip market is influenced by factors such as chip complexity, volume, material costs, and technological advancements. The market typically caters to a wide range of customers, from high-volume consumer electronics manufacturers to specialized applications in automotive and aerospace industries. While flip chip technology offers superior performance compared to traditional wire bonding, it faces competition from other packaging options like ball grid array (BGA) and wafer-level packaging (WLP). However, the demand for miniaturization and high-performance devices continues to drive the adoption of flip chip technology. Marketing and promotion play a crucial role in the APAC flip chip market. Building strong brand reputation, emphasizing technological capabilities, and highlighting the benefits of flip chip packaging are essential for market success. The region's diverse economic landscape, with countries at different stages of development, influences the demand for flip chip solutions. Emerging economies with growing middle classes are driving demand for consumer electronics, while mature economies focus on high-end applications. Population demographics, including urbanization and technological adoption rates, also shape the market. The APAC region is a major hub for semiconductor manufacturing and assembly, leading to significant import and export activities for flip chip components and related materials. Countries like China, South Korea, and Taiwan are both major producers and consumers of flip chips. The region's robust supply chain network supports the growth of the flip chip market.
Market Drivers
• E-commerce Boom and Online Retail: The relentless pursuit of smaller, faster, and more powerful electronic devices has created a strong demand for flip chip packaging in the APAC region. The technology's ability to reduce chip size, improve electrical performance, and enhance thermal management aligns perfectly with the industry's miniaturization goals. As electronic devices become increasingly sophisticated, the need for advanced packaging solutions like flip chip will continue to grow.
• Explosive Growth of Electronics Manufacturing: The APAC region has emerged as the global manufacturing hub for electronics, with countries like China, South Korea, and Taiwan leading the charge. This rapid growth in electronics manufacturing has significantly driven the demand for flip chip technology, as it offers superior performance and miniaturization capabilities compared to traditional packaging methods. The increasing complexity of electronic devices and the need for higher integration levels have fueled the adoption of flip chip in various applications.
•
Market Challenges
• Intense Competition and Price Pressure: The APAC flip chip market is highly competitive, with numerous players vying for market share. This intense competition has led to price pressures and margin erosion. To differentiate themselves and maintain profitability, companies need to focus on technological innovation, cost reduction, and value-added services.
• Technological Complexity and Yield Issues: Flip chip technology is inherently complex, requiring precise alignment, bonding, and testing processes. Achieving high yields and consistent product quality can be challenging, especially for new entrants and manufacturers with limited experience. Overcoming these technical hurdles and improving yield rates is crucial for the successful adoption of flip chip technology.
Based on the report, the Flip Chip market is segmented into Copper Pillar, Solder Bumping, Gold Bumping and Others.Based on the report, the Flip Chip market is segmented into 2D IC, 2.5D IC and 3D IC.
Copper pillar bumping, renowned for its superior electrical conductivity and reliability, has gained significant traction, especially in high-performance computing and mobile applications. Its cost-effectiveness and scalability have made it a preferred choice for many manufacturers in the region. Solder bumping, while still prevalent, is gradually losing ground due to its limitations in terms of thermal management and electrical performance. However, it remains a viable option for certain applications where cost is a primary concern. Gold bumping, known for its excellent corrosion resistance and electrical conductivity, is primarily used in niche applications requiring exceptional reliability and performance. While other bumping technologies like aluminum and conductive polymers exist, their adoption in the APAC market is relatively limited due to technological challenges and cost considerations. The APAC flip chip market is also segmented by packaging technology, encompassing 2D IC, 2.5D IC, and 3D IC. 2D IC packaging, the traditional approach, remains dominant due to its simplicity and cost-effectiveness. However, the increasing demand for higher performance and miniaturization is driving the adoption of 2.5D IC packaging, which offers improved electrical performance and higher integration density. This technology is particularly gaining traction in the region's burgeoning semiconductor industry. While 3D IC packaging holds immense potential for achieving unprecedented levels of integration and performance, its complex manufacturing processes and high costs have limited its widespread adoption in APAC. Nevertheless, research and development efforts are ongoing to address these challenges and accelerate the commercialization of 3D IC technology in the region.
According to the report, the Flip Chip market is segmented into Electronics, Heavy Machinery and Equipment , IT and Telecommunication, Automotive and Other Industries.
The APAC flip chip market is characterized by its diverse application across various industry verticals. The electronics sector, encompassing consumer electronics, computing devices, and telecommunication equipment, is a dominant force driving flip chip demand. The region's burgeoning electronics manufacturing industry, coupled with the increasing complexity of electronic devices, has spurred the adoption of flip chip technology for enhanced performance and miniaturization. The IT and telecommunication industry is another key segment contributing to flip chip market growth. The proliferation of smartphones, tablets, and wearable devices, coupled with the rapid expansion of telecommunication networks, has fueled the demand for high-performance and power-efficient electronic components. Flip chip technology is crucial in enabling the miniaturization and integration of complex functionalities within these devices. While the automotive industry has been a relatively slower adopter of flip chip technology compared to other sectors, its significance is growing rapidly. The increasing electrification of vehicles, coupled with the integration of advanced driver assistance systems (ADAS) and infotainment systems, is driving the demand for high-performance and reliable electronic components. Flip chip technology is gaining traction in automotive applications due to its ability to meet the stringent requirements of the automotive industry. The heavy machinery and equipment sector, although not as prominent as electronics or IT, is also witnessing increased adoption of flip chip technology. The need for robust and reliable electronic components in heavy machinery, such as construction equipment and industrial automation systems, is driving the demand for flip chip solutions. Other industries, including medical devices and aerospace, are emerging as niche markets for flip chip technology, driven by the specific requirements of these sectors.
Based on the report, the major countries covered include China, Japan, India, Australia, South Korea, and the rest of Asia Pacific.
China has solidified its position as the undisputed leader in the Asia-Pacific (APAC) flip chip market. A confluence of factors has propelled the country to the forefront of this technologically advanced sector. The Chinese government's unwavering support for the semiconductor industry, coupled with substantial investments in research and development, has created a fertile ground for innovation and growth. The nation's robust manufacturing ecosystem, coupled with a vast pool of skilled labor, has enabled domestic companies to achieve economies of scale and cost advantages. Moreover, China's burgeoning electronics industry, which encompasses smartphones, consumer electronics, and automotive components, has fueled an insatiable demand for advanced packaging technologies like flip chip. This symbiotic relationship between the electronics and semiconductor sectors has accelerated the adoption and development of flip chip solutions within the country. Additionally, the presence of a strong supply chain for key materials and equipment has further strengthened China's position as a flip chip manufacturing hub. The Chinese government's initiatives to promote domestic semiconductor self-sufficiency have also played a pivotal role in the growth of the flip chip market. Policies aimed at attracting foreign investment and fostering technological collaboration have attracted global semiconductor giants to establish manufacturing facilities and research centers in China. This influx of foreign expertise has contributed to the transfer of knowledge and technology, elevating the overall capabilities of the domestic flip chip industry.
Considered in this report
• Historic year: 2018
• Base year: 2023
• Estimated year: 2024
• Forecast year: 2029
Aspects covered in this report
• Flip Chip market Outlook with its value and forecast along with its segments
• Various drivers and challenges
• On-going trends and developments
• Top profiled companies
• Strategic recommendation
By Bumping Technology
• Copper Pillar
• Solder Bumping
• Gold Bumping
• Others
By Packaging Technology
• 2D IC
• 2.5D IC
• 3D IC
By Industry Vertical
• Electronics
• Heavy Machinery and Equipment
• IT and Telecommunication
• Automotive
• Other Industries
The approach of the report:
This report consists of a combined approach of primary and secondary research. Initially, secondary research was used to get an understanding of the market and list the companies that are present in it. The secondary research consists of third-party sources such as press releases, annual reports of companies, and government-generated reports and databases. After gathering the data from secondary sources, primary research was conducted by conducting telephone interviews with the leading players about how the market is functioning and then conducting trade calls with dealers and distributors of the market. Post this; we have started making primary calls to consumers by equally segmenting them in regional aspects, tier aspects, age group, and gender. Once we have primary data with us, we can start verifying the details obtained from secondary sources.
Intended audience
This report can be useful to industry consultants, manufacturers, suppliers, associations, and organizations related to the Flip Chip industry, government bodies, and other stakeholders to align their market-centric strategies. In addition to marketing and presentations, it will also increase competitive knowledge about the industry.
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